New Connectors for the New Trend
Rescheduled due to Weather
*** Due to weather, this event has been moved to Dec. 11. ***
The Center for Signal Integrity (Penn State Harrisburg) and IEEE Susquehanna Section invites you to a tutorial on proof-of-concept Non-Mating Connectors (NMC), a new connector concept for USB 3.0. Presented by Joshua Benjestorf, CEO of NMC Corporation.
Dinner at 6:30 p.m. (cost $20.00) Students half-price
Talk at 7:30 p.m. (no cost for talk only)
For registration, please contact Dr. Aldo Morales, firstname.lastname@example.org or 717-948-6379.
One of the major challenges facing the consumer electronics industry is the need for ultra-high speed connectors that are insulated from the environment. Standard connector contacts are exposed to the environment giving rise to contact corrosion and signal degradation. Over time these issues have become even more problematic especially in high frequency applications. In this tutorial, one possible solution to this ongoing problem will be presented. It introduces a new connector concept called the Non-Mating Connector (NMC).
The primary motivation behind the development of NMC connectors was to eliminate the need for metal-to-metal ohmic contacts. Ohmic metallic contacts have been used as the primary method of signal transfer since the very beginning of consumer electronics. NMC connectors are different in that they propagate signal data using capacitive and/or magnetic coupling instead of conduction current. This achievement would eliminate the problems associated with internal ohmic contacts and give rise to a connector that is insulated from the environment. It would result in a major breakthrough for consumer electronics.
In this tutorial, proof-of-concept for NMC USB 3.0 connector application will be presented showing excellent performance in comparison to standard USB 3.0 connectors. The experimental setup for the NMC testing is briefly covered. The design and fabrication of actual NMC chips are covered extensively. In short, NMCs hold great promise as waterproof high speed connectors.
About the Presenter
Joshua S. Benjestorf received a B.S. degree in Electrical Engineering and a B.A. degree in Applied Mathematics from University of the Pacific. Previously he has worked in the industry for Intel Corporation in Folsom California and Japanese Solderless (JST) terminal in Nagoya Japan before joining NMC Corporation in 2012 where he currently serves as President and CEO. His research interests are in high-speed data connectivity, electromagnetics, energy conservation and robotics. He is a member of the Institute of Electrical and Electronics Engineers (IEEE).